The self-assembling computer chips of the future | Karl Skjonnemand

The Miniaturization of Computers

This section discusses how computers have evolved from being as big as a room to fitting in our pockets and even being implanted inside our bodies. It highlights the role of miniaturization of transistors in enabling this transformation.

Evolution of Computer Size

• Computers used to be as big as a room, but now they are small enough to fit in our pockets or on our wrists.

• Miniaturization of transistors has played a crucial role in making computers smaller and more portable.

• Transistors are tiny switches that form the circuits at the heart of computers.

Achievements through Science and Engineering

• Decades of development, breakthroughs in science and engineering, and significant investments have led to the miniaturization of transistors.

• This progress has given us vast computing power, large memory capacities, and the digital revolution we experience today.

Digital Roadblock

• The rate of miniaturization of transistors is slowing down.

• At the same time, software innovation continues with artificial intelligence (AI) and big data applications.

• There is a concern that hardware limitations may start limiting what can be achieved with software.

Frustration with Hardware Limitations

• Users often experience frustration when their old smartphones or tablets slow down due to software updates and new features.

• Software engineers constantly push the limits of hardware capacity.

The Need for Keeping Up with Software

This section emphasizes the importance of keeping up with software advancements to avoid limitations imposed by hardware capabilities.

Amazing Software Innovations

• AI, facial recognition, augmented reality, and autonomous driving are examples of incredible software innovations happening today.

Potential Limitations by Hardware

• If hardware cannot keep up with software demands, the development of technology may be hindered.

• The appetite for software capabilities should be matched by hardware advancements.

Frustration with Aging Devices

• Users often experience frustration when their devices become slow and struggle to handle new software updates.

• Hungry software engineers consume all available hardware capacity.

Slowing Down of Transistor Miniaturization

This section explains why the rate of miniaturization of transistors is slowing down due to manufacturing complexities.

Manufacturing Complexity

• The rate of miniaturization is slowing down due to the increasing complexity of the manufacturing process.

• Integrated circuits are built layer by layer on pure crystalline silicon wafers.

Achievements in Transistor Miniaturization

• After 50 years of continuous development, transistor features can now reach dimensions as small as 10 nanometers.

• More than a billion transistors can fit in a single square millimeter of silicon.

Nanoscale Technology

• Transistors are incredibly small compared to human hair or red blood cells.

• Smaller transistors offer faster and more efficient switching, leading to lower cost, higher performance, and higher efficiency electronics.

Challenges in Conventional Manufacturing

This section highlights the challenges faced by conventional manufacturing techniques for integrated circuits.

Layer-by-Layer Manufacturing Process

• Integrated circuits are manufactured by projecting every tiny feature onto a silicon wafer and etching it into underlying layers using light-sensitive material.

Approaching Physical Limitations

• As transistor features get smaller, conventional manufacturing techniques face physical limitations.

Costly Patterning Systems

• The latest patterning systems used in semiconductor factories reportedly cost over $100 million each.

Molecular Engineering for Chip Manufacturing

This section introduces the concept of using molecular engineering to revolutionize chip manufacturing.

Alternative Approach

• Molecular engineering and mimicking nature at the nanoscale dimensions of transistors offer a different and potentially more cost-effective way of chip manufacturing.

Highly Periodic Structure

• Integrated circuits have highly periodic structures with repeated features.

• Conventional manufacturing projects every tiny feature onto silicon, but an alternative approach is needed.

New Section

This section discusses the concept of self-assembly and its application in semiconductor technology manufacturing.

Self-Assembly as a Robust Solution

• Self-assembly is observed in nature and can be a robust solution for manufacturing.

• Examples include lipid membranes and cell structures.

• If it works for nature, it should work for us.

Block Co-Polymer Self-Assembly

• Block co-polymers consist of two polymer chains that repel each other.

• The chains are bonded together, creating frustration in the system.

• The natural self-assembled shape formed is nanoscale, regular, periodic, and suitable for transistor arrays.

Molecular Engineering for Different Structures

• Molecular engineering allows the design of different shapes and sizes of self-assembled structures.

• Symmetrical molecules result in long meandering lines resembling fingerprints.

• Unsymmetrical molecules create more elaborate structures like cylinders.

Using Chemistry to Manufacture Nanoscale Features

• Chemistry and chemical engineering are used to manufacture nanoscale features required for transistors.

Directed Self-Assembly

• Directed self-assembly involves aligning self-assembled structures precisely to avoid defects.

• Tiny defects could cause transistor failure due to the large number of transistors in an integrated circuit.

• Extraordinary measures are taken to achieve molecular perfection in the system.

Potential Impact on Semiconductor Industry

• Directed self-assembly is still in development but has the potential to revolutionize semiconductor manufacturing within a few years.

• It enables cost-effective miniaturization of transistors and supports the expansion of computing and digital revolution.

• It may also lead to advancements in molecular manufacturing.